Structural Design of Plastic IC Packages
نویسندگان
چکیده
منابع مشابه
Research on Delamination Failure of Plastic Ic Packages in Components Reuse Processes
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ژورنال
عنوان ژورنال: JSME international journal. Ser. 1, Solid mechanics, strength of materials
سال: 1989
ISSN: 0914-8809
DOI: 10.1299/jsmea1988.32.3_320